The work program is aimed at the technological development from the fundamental physics to the scale up and design of an integrated cooling solution for electronic components. The most promising cooling strategies will be tested and the best performing strategy will be addressed in an integrated solution, which will be designed and scaled up to operate as a specific cooling functional technology. This functional solution should integrate the entire system, comprising all the required auxiliary components.

The working plan is divided in 4 tasks:

• Task 1 addresses the development of a test bed mimicking the thermal behaviour of a thermoelectric system (cold side), in both steady-state and transient conditions, which will be used to compare the liquid cooling strategies to test.
• Task 2 encompasses the actual comparison between the different cooling strategies. The analysis firstly focus on the fundamentals of the influencing parameters and governing phenomena to understand and identify the main mechanisms to be explored in maximizing the cooling capacity of the tested techniques. Then, a more systematic and objective approach is followed to evaluate the thermal performance, balanced by pumping power and system efficacy to dissipate the heat loads in the test bed devised in Task 1, under relevant working conditions.
• Task 3, in close relation with Task 2, explores innovative solutions to customize liquid and particularly surface properties, introducing new surface topographical and chemical structures to further improve the heat transfer processes in the most promising cooling technique tested in Task 2.
• Task 4 addresses the product design to turn the best performing strategy in a functional integrated solution that can be further developed in a commercial product in a subsequent project.